The following is the production process of the double-layer motherboard of the Orange Technology charging pile, which reveals the core of the AC charging pile  motherboard:

Design Planning:

Determine the functional requirements, performance indicators, and overall architecture of the motherboard.

Design circuit schematics, including power management, charging control, communication modules, etc.

Plan a double-layer layout, considering component distribution, circuit routing, and heat dissipation channels.

Raw material procurement:

Purchase necessary electronic components such as chips, resistors, capacitors, inductors, etc.

To prepare a PCB (printed circuit board) substrate, materials with good electrical performance and heat resistance are usually selected.

PCB production:

Transfer circuit patterns onto PCB substrates through photolithography technology.

Perform etching, drilling and other processes to form circuits and installation holes.

Component mounting:

Use an automated surface mount machine to accurately install electronic components in their respective positions on the PCB.

For some large or special components, manual installation may be required.

welding:

By using processes such as reflow soldering or wave soldering, firmly connect the component pins to the solder pads on the PCB.

Double layer connection:

Use special connectors, vias, or blind holes to achieve electrical connections between double-layer PCBs.

Testing and Inspection:

Conduct electrical performance testing, including measurement of resistance, capacitance, and inductance values, as well as circuit on/off testing.

Perform functional testing to verify if charging control, communication, and other functions are functioning properly.

Conduct reliability testing, such as thermal cycling testing, vibration testing, etc., to ensure the stability of the motherboard in different environments.

Cleaning and Protection:

Remove solder residue and impurities from the motherboard.

Apply protective coatings, such as three proof paint, to enhance the moisture, dust, and corrosion resistance of the motherboard.

Packaging and Storage:

Package qualified double-layer charging station motherboards to prevent damage during transportation and storage.